iSuppli Estimates iPhone 3G S BOM Cost Around $179 iSuppli估計，iPhone的3G擰的BOM成本約為179美元

Not long after the Apple latest 3G S iPhone being launched, some may curious to figure out what cost it takes up to come out with this powerful gadget.不久之後，蘋果最新的3G iPhone手機正在發起，有些人可能好奇，想找出成本佔用走出來與這個強大的工具。 A recent BOM (Bill of Material) cost analysis by iSuppli disclosed that the cost to fabricate a 3G S iPhone is estimated to be $178.96, for a 16GB version, which is slightly more expensive than its predecessor 3G at $174.33 for 8GB version.最近的BOM（物料清單）成本分析，iSuppli公司透露，製造成本的3G iPhone將是估計178.96美元，一個16GB的版本，這是較昂貴的3G比它的前輩在174.33美元為8GB的版本。

Out of the total estimated amount, Toshiba NAND flash ROM was identified to be one of the most expensive components, with cost price around $24 for 16GB and $46 for 32GB capacity.出總的估計數額，東芝NAND閃存ROM被認定為一個最昂貴的組件，以成本價為24美元左右16GB和46美元的32GB的容量。 Besides, Samsung ARM Cortex processor has been upgraded from previously 412MHz to 600MHz that contributed to the slight increase to new cost of $14.46.此外，三星的ARM Cortex處理器已經從以前412MHz升級至600MHz，有助於促進略有增加新的成本一十四點四六美元。 Other expensive components include both the Touch Screen and 3.5-inch 16Megapixel display Module that occupy significant $35 out of the total BOM cost.其他昂貴的組件既包括觸摸屏和3.5英寸16Megapixel顯示模塊，佔據著35美元，在總共BOM成本。 Not much change on the Infineon Baseband HSDPA/EDGE chip at around $13, the new 3G S employs an integrated Bluetooth, Wi-Fi and Nike Transceiver wireless module as well as some new chips such as magnetometer (from AKM Semiconductor), accelerometer (from ST Microelectronics) and power management chip (from Dialog Semiconductor) that contribute to the cost increase.沒有多大改變的英飛凌基帶的HSDPA / EDGE芯片在13元左右，新的3G擰採用了集成藍牙，Wi - Fi和無線收發模塊，耐克以及一些新的芯片，例如磁力儀（從AKM Semiconductor公司），加速度（從意法半導體）和電源管理芯片（從對話框半導體）有助於增加的成本。

Despite a slight cost increase that may cut down its overall margin, the performance boost in terms of faster processing power, bigger storage space and enhanced features are believed to be able to push more volume sales into consumer market space.儘管略有增加成本，可能降低其總體幅度，在性能提升方面更快的處理能力，更大的存儲空間和增強的功能，相信能夠把更多的銷量進入消費市場空間。

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