iSuppli Estimates iPhone 3G S BOM Cost Around $179 iSuppli Estimates iPhone 3G S BOM Gastos Around $ 179

Not long after the Apple latest 3G S iPhone being launched, some may curious to figure out what cost it takes up to come out with this powerful gadget. Hindi nagtagal ang Apple pinakabagong S 3G iPhone na inilunsad, ang ilan ay maaaring usisero para malaman kung ano ang gastos na aabutin hanggang sa lumapit lumitaw kumuha ito makapangyarihan gadget. A recent BOM (Bill of Material) cost analysis by iSuppli disclosed that the cost to fabricate a 3G S iPhone is estimated to be $178.96, for a 16GB version, which is slightly more expensive than its predecessor 3G at $174.33 for 8GB version. Ang isang kamakailan-lamang na BOM (Bill of Material) gastos sa pagtatasa sa pamamagitan ng iSuppli isiwalat na gastos upang magbuo ng isang 3G iPhone S ay tinatayang na $ 178.96, para sa isang 16GB na bersyon, na kung saan ay bahagyang mas mahal kaysa sa kanyang hinalinhan 3G sa $ 174.33 para sa 8GB salin.

Out of the total estimated amount, Toshiba NAND flash ROM was identified to be one of the most expensive components, with cost price around $24 for 16GB and $46 for 32GB capacity. Out ng kabuuang tinatayang halaga, Toshiba NAND flash ROM ay kinilala na isa sa mga pinaka-mamahaling mga sangkap, kasama ang gastos sa presyo sa paligid ng $ 24 para sa 16GB at $ 46 para sa 32GB capacity. Besides, Samsung ARM Cortex processor has been upgraded from previously 412MHz to 600MHz that contributed to the slight increase to new cost of $14.46. Bukod, Samsung braso Cortex processor ay na-upgrade mula sa dating 412MHz sa 600MHz na contributed sa bahagyang pagtaas sa mga bagong halaga ng $ 14.46. Other expensive components include both the Touch Screen and 3.5-inch 16Megapixel display Module that occupy significant $35 out of the total BOM cost. Iba pang mga mamahaling mga sangkap na kasama ang parehong mga Touch Screen at 3.5-dali 16Megapixel display Module na maghawak ng makabuluhang $ 35 sa labas ng kabuuang gastos BOM. Not much change on the Infineon Baseband HSDPA/EDGE chip at around $13, the new 3G S employs an integrated Bluetooth, Wi-Fi and Nike Transceiver wireless module as well as some new chips such as magnetometer (from AKM Semiconductor), accelerometer (from ST Microelectronics) and power management chip (from Dialog Semiconductor) that contribute to the cost increase. Hindi gaanong pagbabago sa Infineon Baseband HSDPA / gilid maliit na tilad sa paligid ng $ 13, ang bagong 3G S employs isang pinagsama-samang Bluetooth, Wi-Fi at Nike radyo at pagsasahipapawid wireless module pati na rin ang ilang mga bagong chips tulad ng magnetometer (mula sa AKM semikondaktor), accelerometer (mula sa ST Microelectronics) at kapangyarihan sa pamamahala ng maliit na tilad (mula sa Dialog semikondaktor) na magbigay ng kontribusyon sa dagdagan ang gastos.

Despite a slight cost increase that may cut down its overall margin, the performance boost in terms of faster processing power, bigger storage space and enhanced features are believed to be able to push more volume sales into consumer market space. Sa kabila ng isang bahagyang pagtaas gastos na maaaring magbawas ang kabuuang margin, ang pagganap mapalakas sa mga tuntunin ng mas mabilis sa pagpoproseso ng kapangyarihan, mas malaking storage space at pinahusay na mga katangian ay naniwala para ma-push mas maraming mga benta ng lakas ng tunog sa mga consumer market space.

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