iSuppli Estimates iPhone 3G S BOM Cost Around $179 iSuppli Ocene iPhone 3G S BOM stal približno 179 $

Not long after the Apple latest 3G S iPhone being launched, some may curious to figure out what cost it takes up to come out with this powerful gadget. Ne dolgo po tem, ko je začel Apple iPhone najnovejše 3G S, nekateri lahko radoveden, da ugotovimo, kakšno ceno je potrebno priti do določenih s tem močno gadget. A recent BOM (Bill of Material) cost analysis by iSuppli disclosed that the cost to fabricate a 3G S iPhone is estimated to be $178.96, for a 16GB version, which is slightly more expensive than its predecessor 3G at $174.33 for 8GB version. Nedavni BOM (Bill of Material), analiza stroškov, ki jih iSuppli razkrije, da so stroški za proizvodnjo iPhone 3G S je ocenjena na 178,96 $, za 16GB različica, ki je nekoliko dražja kot njegov predhodnik 3G na 174,33 $ za 8GB različico.

Out of the total estimated amount, Toshiba NAND flash ROM was identified to be one of the most expensive components, with cost price around $24 for 16GB and $46 for 32GB capacity. Od skupnega predvidenega zneska, je nesmisel NAND flash ROM opredelila za eno najdražjih sestavnih delov, s ceno okoli 24 $ za 16GB in $ 46 za 32GB zmogljivosti. Besides, Samsung ARM Cortex processor has been upgraded from previously 412MHz to 600MHz that contributed to the slight increase to new cost of $14.46. Poleg tega je bil Samsung ARM Cortex procesor nadgrajen iz predhodno 412MHz do 600MHz, ki so prispevali k nekoliko povečala za nove stroške za 14,46 $. Other expensive components include both the Touch Screen and 3.5-inch 16Megapixel display Module that occupy significant $35 out of the total BOM cost. Druge komponente vključujejo tako drag zaslon na dotik in 3,5-palčni zaslon 16Megapixel modul, ki zasedajo pomembne $ 35 od skupnih stroškov BOM. Not much change on the Infineon Baseband HSDPA/EDGE chip at around $13, the new 3G S employs an integrated Bluetooth, Wi-Fi and Nike Transceiver wireless module as well as some new chips such as magnetometer (from AKM Semiconductor), accelerometer (from ST Microelectronics) and power management chip (from Dialog Semiconductor) that contribute to the cost increase. Ni veliko sprememb na osnovnem pasu Infineon HSDPA / EDGE čip v okrog $ 13, novi 3G S zaposluje integriran Bluetooth, Wi-Fi in Nike Transceiver brezžični modul, kot tudi nekaterih novih čipov, kot so magnetometer (od AKM Semiconductor), pospeška (od ST Microelectronics) in upravljanja energije čipa (od Dialog Semiconductor), ki prispevajo k povečanju stroškov.

Despite a slight cost increase that may cut down its overall margin, the performance boost in terms of faster processing power, bigger storage space and enhanced features are believed to be able to push more volume sales into consumer market space. Kljub rahlo povečanje stroškov, ki bi lahko zmanjšali svoje splošne stopnje, so povečati učinkovitost v smislu hitrejše obdelave energije, večji prostor za shranjevanje in izboljšane funkcije verjeli, da lahko za potiskanje več obsega prodaje na potrošniški trg prostor.

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