iSuppli Estimates iPhone 3G S BOM Cost Around $179 Procjene iSuppli 3G iPhone S BOM košta oko 179 $

Not long after the Apple latest 3G S iPhone being launched, some may curious to figure out what cost it takes up to come out with this powerful gadget. Nedugo nakon što je ispaljen najnoviji Primijeniti na 3G iPhone S, neki svibanj znatiželjan to odgonetati što trošak je potrebno i do izaći s ovim moćna naprava. A recent BOM (Bill of Material) cost analysis by iSuppli disclosed that the cost to fabricate a 3G S iPhone is estimated to be $178.96, for a 16GB version, which is slightly more expensive than its predecessor 3G at $174.33 for 8GB version. Nedavne BOM (Bill of material) analiza troškova po iSuppli otkrila da je cijena za proizvoditi 3G iPhone S procjenjuje se na 178,96 dolara, za 16 GB verziju, koja je malo skuplji od svog prethodnika 3G na 174,33 dolara za 8 GB verziju.

Out of the total estimated amount, Toshiba NAND flash ROM was identified to be one of the most expensive components, with cost price around $24 for 16GB and $46 for 32GB capacity. Od ukupnog procijenjenog iznosa, Toshibin NAND flash ROM-a je identificiran biti jedan od najskupljih dijelova, sa cijenom cijena oko $ 24 za 16GB i $ 46 za 32GB kapaciteta. Besides, Samsung ARM Cortex processor has been upgraded from previously 412MHz to 600MHz that contributed to the slight increase to new cost of $14.46. Osim toga, SAM-ovi RUKA Kora Procesor je nadograđen iz prethodno 412MHz do 600MHz koje su doprinijele blagi porast na nove cijene 14,46 dolara. Other expensive components include both the Touch Screen and 3.5-inch 16Megapixel display Module that occupy significant $35 out of the total BOM cost. Ostale komponente uključuju i skupo zaslonom osjetljivim na dodir i 3.5-palac zaslon 16Megapixel modula koje zauzimaju značajne $ 35 od ukupno BOM trošak. Not much change on the Infineon Baseband HSDPA/EDGE chip at around $13, the new 3G S employs an integrated Bluetooth, Wi-Fi and Nike Transceiver wireless module as well as some new chips such as magnetometer (from AKM Semiconductor), accelerometer (from ST Microelectronics) and power management chip (from Dialog Semiconductor) that contribute to the cost increase. Nije mnogo promjena na Infineon Baseband HSDPA / EDGE čip na oko $ 13, novi 3G S zapošljava integriran Bluetooth, Wi-Fi i Nike Transceiver bežični modul, kao i neke nove kao što je magnetometar čips (od AKM Poluvodički), akcelerometar (od ST Microelectronics) i upravljanje energijom čip (od Dialog Poluvodički) koje doprinose povećanju troškova.

Despite a slight cost increase that may cut down its overall margin, the performance boost in terms of faster processing power, bigger storage space and enhanced features are believed to be able to push more volume sales into consumer market space. Unatoč blagi porast troškova koje svibanj sasjekao cjelokupnu margina, povećanje performansi u pogledu brže obrade snage, veći prostor za pohranu i poboljšane značajke se vjeruje da bi mogli gurati više volumena prodaje na tržištu potrošačke prostor.

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