Fujitsu Unveils World First 125 Degree Celcius Compliant FCRAM for Consumer Market Fujitsu Unveils World Unang 125 Degree Sentigrado sang FCRAM para sa Consumer Market
Wonder how extreme can the operating temperature of a memory chip go without failure? Magtaka kung paano busaksak maaari sa operating temperatura ng isang memory chip pumunta walang failure? Typically for extended temperature, it can goes as high as 95 degree Celsius but this time Fujitsu Microelectronics America has able to break the technology barrier by unveiling two new FCRAM memory chips that can extend the operating temperature up to 125 degree Celsius suitable for extreme environment. Karaniwan para sa temperatura ng palugit, ito ay maaaring napupunta bilang mataas na bilang 95 degree Sentigrado ngunit oras na ito Fujitsu Microelectronics Amerika ay able sa basagin ang teknolohiya barrier sa pamamagitan ng unveiling ng dalawang bagong FCRAM memory chips na palawigin ang operating temperatura hanggang sa 125 degree Sentigrado na angkop para sa mga labis-labis na kapaligiran. Available in both 512Mbit and 256Mbit technology, codenamed as MB81EDS516545 and MB81EDS256545 respectively, they are claimed to be the world's first FCRAM memory module that being designed in such a high operating temperature specifications targeted for consumer and industrial usages. Magagamit na sa parehong 512Mbit at 256Mbit teknolohiya, codenamed bilang MB81EDS516545 at MB81EDS256545 ayon, sila ay inaangkin na ang mundo sa unang FCRAM memory module na ay dinisenyo sa isang mataas na temperatura ng operating na naka-target na para sa mga mamimili at pang-industriya usages.
The new FCRAM is specially designed to be used with SiPs (System in Package) to withstand extreme temperature as most of the conventional memory module can only go up to maximum of 95 degree Celsius while the SoC (System on Chip) package can easily reach 125 degree Celsius without affecting its normal functionality. Ang bagong FCRAM ay espesyal na dinisenyo upang magamit sa SiPs (System sa Package) sa makatiis sukdulan temperatura tulad ng karamihan ng mga maginoo memory module ay maaari lamang maging hanggang sa pinakamataas na ng 95 degree Sentigrado habang ang SoC (System sa Chip) pakete ay madaling maabot ang 125 degree Sentigrado nang hindi naaapektuhan ang kanyang normal na pag-andar. An alternative solution to conventional memory usage is to add some kind of heatsink or heat spreader with the hope that it can dissipate heat to keep the whole system in operable temperature range but with that, it adds additional cost and stack up which eventually affect its competitiveness and outlook of the end products. Isang alternatibong solusyon sa maginoo memory paggamit ay ang magdagdag ng ilang mga uri ng heatsink o init spreader sa ang pag-asa na ito ay pumaram init na panatilihin ang buong sistema sa umaandar temperatura ngunit may saklaw na, ito ay nagdadagdag ng karagdagang gastos at stack up na sa wakas makaka-apekto sa kanyang competitiveness at pananaw ng mga dulo produkto.
More importantly, the new FCRAM is expected to be able to outperform existing DDR SDRAM in terms data speed as well as power consumption. Higit sa lahat, ang mga bagong FCRAM ay inaasahan sa maaari able sa outperform umiiral DDR SDRAM sa bilis ng mga termino ng data pati na rin ang power consumption. It is claimed to transfer data two times faster while only draw less than 50 percent of power consumption as compared to conventional memory module. Ito ay inaangkin para maglipat ng data ng dalawang beses na mas mabilis na habang lamang maglabas ng mas mababa sa 50 porsyento ng kapangyarihan consumption bilang kung ihahambing sa maginoo memory module. Currently these modules are already available for order and pricing availability is upon request. Sa kasalukuyan ang mga modules ay magagamit para sa mga order at pricing ay makukuha kung hihilingin.
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