Intel Boosts Mobile Proces’ Cuv�ntare cu Step� Scimbare

Intel is planning la spre a face step� scimbare on s�u existing series de mic pachet Core 2 Duo as well as �elin� M mobile proces �n�untru un effort la spre upgrade cuv�ntare enhancement �i eventually boost sus sistem performance as un �ntreg. Art.hot. a afecta model a cuprinde Core 2 Duo SL9300, SL9400, SP9300 �i SP9400 cu step� scimbare de la C-0 la spre E-0 �i Core 2 Solo SU3300, Core 2 Duo SU9300, SU9400 as well as �elin� M ULV (Ultra Low Voltaj) model de la M-0 la spre R-0.

Both step� scimbare e�ti having un virgul� goal: it voin�� a voi a fi un cuv�ntare patetic improvement that voin�� a voi increase art.hot. ceas frequency f�r� major scimbare �n�untru electric, mechanical �i acolo simulation. Normally, art.hot. giant companie voin�� a voi a face un silicon step� scimbare oric�nd acolo e�ti ni�te bug fixat sau improvement made la spre s�u articole de fier proces. �i acolo it voin�� a voi a fi un num�r prefixed cu un alphabet that indicates cum major art.hot. step� scimbare is. Obviously, this seems la spre a fi un major scimbare numai acolo is nu much detail has been a comunica except art.hot. cuv�ntare patetic improvement.

Art.hot. scimbare voin�� a voi a lua efect by Decembrie 2008 �i art.hot. actual masaj transport voin�� a voi fericit on Martie 2009 unic. Nu expectation de scimbare la spre orice obicei’ board design dac� obicei were la spre a adopta art.hot. nou steppings’ proces, except un nou BIOS (that voin�� a voi a verifica pentru silicon copie Identitate) aceasta este tot claimed la spre a fi compatible cu both curent �i nou step� voin�� a voi a fi released la spre cater pentru art.hot. step� scimbare.

import: Aceasta este o machine a traduce pagin� care is provided "as is" f�r� warranty. Machine traducere Mai a fi difficult la spre understand. A face pe plac la refer la spreorigine Englez anghinar� oric�nd posibil.

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• Miutech Avion pentru Primul Hybrid Dual PC Baz� On Intel Atom �i BRA� Proces
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