Intel Disclosed Next Generation Atom Pineview Processor with Integrated Graphics and Memory on Core during IDF 2008英特尔披露下一代原子Pineview处理器集成显卡和内存的核心以色列国防军在2008年
Intel Atom processor has been getting huge demand from board vendors that caused shortage issue in the supply chain.英特尔原子处理器已经获得的巨大需求的供应商从电路板，造成短缺的问题在供应链中。 Despite the current situation and potential competition from both VIA’s尽管当前的形势和潜在的竞争，从威盛 Nano纳米 and AMD’s和AMD的 Bobcat山猫 processor, Intel has unveiled a next generation Atom processor during recent IDF (Intel Developer Forum) 2008 as a replacement for existing Atom processor.处理器，英特尔已经推出了下一代处理器的原子在最近的以色列国防军（英特尔开发者论坛） 2008年，目的是要取代现有的原子处理器。 Codenamed as Pineview, it is based on Lincroft micro architecture that is believed to be more powerful and thermal efficient as compared to existing Silverthorne based architecture.代号为Pineview ，它是基于Lincroft微架构，被认为是更加强大和热效率相比，现有的Silverthorne的基础架构。
What is so special about this Lincroft architecture is that it will actually integrate the graphics core as well as memory controller into the silicon package itself.是什么使这个特殊的Lincroft架构是，它实际上将整合图形核心以及记忆体控制器到硅包本身。 The advantage is obvious - the data latency can be reduced significantly that will eventually improve the whole system performance.其优点是显而易见的-数据潜伏期可显着降低，最终将提高整个系统的性能。 However, not much detail has been disclosed if it will increase the total package size since everything are now packed into the die itself.然而，没有多少详细透露是否会增加总的封装尺寸，因为现在一切都装入模具本身。 It further disclosed that DMI (Direct Media Interface) will be replacing conventional FSB (Front Side Bus) to connect Pineview Atom core to IO chip respectively.它进一步透露，怎样（直接媒体接口）将取代传统前端总线（前端总线）连接Pineview原子核心的IO芯片分别。
The next generation processor will be available in market by second half of 2009 in both single and duo core version.新一代处理器将可在市场2009年下半年在单一和多核心的版本。 It is expected that Intel will keep its momentum to continue penetrate into existing MID (Mobile Internet Device) and UMPC (Ultra Mobile PC) as well as embedded markets with its famous Atom family processors.预计英特尔公司将保持其势头将继续渗透到现有的MID （移动互联网设备）和的UMPC （超移动PC ） ，以及嵌入式市场与著名的原子系列处理器。 Only one thing, they may need to resolve its manufacturing process issue so that the demand will not be the bottleneck due to overwhelming response from all the interested parties.只有一件事，他们可能需要解决其制造工艺问题，使需求将不会是瓶颈由于反应热烈，所有有关各方。
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