Intel Unveiled EP80579 SoC Targeted to Replace Atom with Single Chip Solution for MID and Embedded Market Intel Unveiled EP80579 SoC Targeted sa Palitan ng Atom sa Single Chip solusyon para sa kalagitnaan at embed Market
Intel Inc has just disclosed a new SoC (System on Chip) as a follow on product after the successful launch of the Intel low power Atom family processors. Intel Inc ay lamang isiwalat ng isang bagong SoC (System sa Chip) bilang isang pang-follow sa mga produkto matapos ang matagumpay na ilunsad ng Intel mababa kapangyarihan Atom processors pamilya. Named as EP80579, it is a newly designed SoC that is targeted at MID (Mobile Internet Device), in-car infotainment systems, industrial control and other newly explored market segments. Pinangalanan bilang EP80579, ito ay isang bagong disenyo SoC na naka-target sa kalagitnaan ng (Mobile Internet Device), in-kotse infotainment sistema, pang-industriya na kontrol at iba pang mga bagong explored market segment.
The new SOC will be based on Intel Pentium M processor architecture with some major enhancements. Ang bagong SOC ay base sa Intel Pentium M processor architecture sa ilang mga pangunahing mga pagpapahusay. As different from the previous common 3-chips solution that include a processor core, MCH (Memory Controller Hub) and ICH (I/O Hub), Intel has made a major breakthrough by able to integrate all of them into one chip, and yet able to maintain major functions such as security, data path engines acceleration as well as the latest Quick Assist technology. Bilang naiiba mula sa mga nakaraang mga karaniwang 3-chips na solusyon ay nagsasama ng isang processor na core, MCH (Memory Controller masa) at ICH (I / O masa), Intel ay ginawa ng isang malaking pambihirang tagumpay sa pamamagitan ng maka-samahin ang lahat ng mga ito sa isang maliit na tilad, at pa kakayahan upang mapanatili ang mga pangunahing pag-andar gaya ng seguridad, data sa landas engine acceleration pati na rin ang pinakabagong Mabilisang Assist teknolohiya. No doubt, by having all these capabilities into single chip, it will reduce the latency of data transfer from core to memory controller, and eventually boost up the whole system performance. Walang agam-agam, sa pamamagitan ng pagkakaroon ng lahat ng mga kakayahan sa iisang maliit na tilad, ito ay mabawasan ang latency ng paglilipat ng data mula sa kaibuturan ng memory controller, at sa huli mapalakas ang pagganap ng buong sistema. Not only that, developers will be able to enjoy more flexibility and simplicity in terms of board and thermal design due to its smaller form factor and lower TDP (Thermal Dissipation Power) as compared to existing solutions. Hindi lamang na, developer ay maaaring makapag-enjoy mas naiaagpang at kababaang-loob sa mga tuntunin ng board at mainit na disenyo dahil sa kanyang maliit na mga form na kadahilanan at mababang TDP (Thermal pagwawaldas Power) bilang kung ihahambing sa mga umiiral na mga solusyon. It is forecasted that the SoC solution will be able to reduce the total board footprint up to 45 percent while featuring lower thermal dissipation of up to 34 percent. Ito ay forecasted na ang SoC solusyon ay maaaring mabawasan ang kabuuang board bakas ng paa hanggang sa 45 porsyento na mas mababa habang mainit-aaksaya ng hanggang sa 34 porsyento. Most importantly, the new solution will be based on X86 architecture that makes the software porting a simple effort as compared to other ARMS or non X86 archictectures. Pinaka-mahalaga, ang mga bagong solusyon na ito ay batay sa X86 architecture na gumagawa ng software ng porting isang simpleng pagsisikap bilang kumpara sa iba pang mga Arms o hindi X86 archictectures. Hopefully with all these major advantages, developers can shorten the design cycle and get the platform and end products to the market at the earliest possible. Inaasahan namin na kasama ang lahat ng mga pangunahing bentahe, developer maaari iklian ang disenyo cycle at makuha ang platform at huling mga produkto sa merkado sa earliest posible. Some of the upcoming SoC products that are already in roadmap include Canmore, Sodaville, Moorsetown and more and hopefully they are able to fill up those power sensitive market segments including Apple's future generation iPhone. Ang ilan sa mga paparating na SoC produkto na nasa roadmap isama Canmore, Sodaville, Moorsetown at iba pa at sana sila ay able sa punuin ang mga kapangyarihan sensitive market segment kasama Apple's hinaharap salinlahi iPhone.
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