Intel Unveiled EP80579 SoC Targeted to Replace Atom with Single Chip Solution for MID and Embedded Market Intel razkrila EP80579 SOC Ciljane Zamenjaj Atom s enoten čip Raztopina za MID in vgrajenih trg
Intel Inc has just disclosed a new SoC (System on Chip) as a follow on product after the successful launch of the Intel low power Atom family processors. Intel je pravkar Inc razkrijejo novo SOC (System na Chip), kot nadaljevanje priporočil o proizvodu po uspešnem začetku Intel nizke moči Atom družine procesorjev. Named as EP80579, it is a newly designed SoC that is targeted at MID (Mobile Internet Device), in-car infotainment systems, industrial control and other newly explored market segments. Imenovan kot EP80579, je na novo zasnovani SSoch, ki je usmerjena v MID (Mobile Internet Device), v avtu Infozabava sistemov, industrijskih in drugih nadzornih novo raziskati tržne segmente.
The new SOC will be based on Intel Pentium M processor architecture with some major enhancements. Nova SOC bo temeljila na Intel Pentium M procesorja arhitekturo z nekaj večjih izboljšav. As different from the previous common 3-chips solution that include a processor core, MCH (Memory Controller Hub) and ICH (I/O Hub), Intel has made a major breakthrough by able to integrate all of them into one chip, and yet able to maintain major functions such as security, data path engines acceleration as well as the latest Quick Assist technology. Ker je drugačen od prejšnjih skupnih 3-čipov raztopine, ki vsebuje procesor jedro, MCH (Memory Controller Hub) in ICH (I / O Hub), Intel je dosegla velik preboj, ki ga mogla vključiti vse od njih v enem čipu, in še sposobne ohraniti glavne funkcije, kot so varnost, podatkov pot motorjev pospešek kot tudi najnovejšo tehnologijo Quick Assist. No doubt, by having all these capabilities into single chip, it will reduce the latency of data transfer from core to memory controller, and eventually boost up the whole system performance. Ni dvoma, ki jih imajo vse te zmogljivosti v enoten čip, bo zmanjšanje latence za prenos podatkov iz jedra na pomnilniški krmilnik, in sčasoma povečati višino celotnega sistema. Not only that, developers will be able to enjoy more flexibility and simplicity in terms of board and thermal design due to its smaller form factor and lower TDP (Thermal Dissipation Power) as compared to existing solutions. Ne samo, da razvijalci bodo lahko uživali več prožnosti in enostavnosti v smislu krovu in toplotne načrtovanja zaradi svojih manjših obliki faktorja in nižji TDP (Thermal Power razpadom) v primerjavi z obstoječimi rešitvami. It is forecasted that the SoC solution will be able to reduce the total board footprint up to 45 percent while featuring lower thermal dissipation of up to 34 percent. Prav je, da je napovedana SOC rešitev lahko zmanjšanje skupnega odbora odtis do 45 odstotkov, medtem ko prikazujejo nižje termalne razpršitve do 34 odstotkov. Most importantly, the new solution will be based on X86 architecture that makes the software porting a simple effort as compared to other ARMS or non X86 archictectures. Najpomembneje je, da je nova rešitev bo temeljila na x86 arhitekturo, ki omogoča preprost prenos programske napor v primerjavi z drugimi orožjem ali brez x86 archictectures. Hopefully with all these major advantages, developers can shorten the design cycle and get the platform and end products to the market at the earliest possible. Upajmo, da pri vseh teh glavnih prednosti, razvijalci lahko skrajšajo zasnove in dobili platformo in končne proizvode na trg v najkrajšem možnem času. Some of the upcoming SoC products that are already in roadmap include Canmore, Sodaville, Moorsetown and more and hopefully they are able to fill up those power sensitive market segments including Apple's future generation iPhone. Nekatere prihajajočih SOC izdelki, ki so že v načrt vključijo Canmore, Sodaville, Moorsetown in več in upamo, da so sposobna izpolnite tiste moči občutljivih segmentih trga tudi za prihodnje generacije Apple iPhone.
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