3G Apple iPhone Potentially Powered by Infineon Chip Available This Year苹果iPhone的3G可能采用英飞凌芯片今年推出
Apple’s iPhone has been selling like hot cake since its official launch last year.苹果的iPhone已经销售热蛋糕一样,因为它正式推出去年。 No doubt it has some great features such as multi scroll and excellent software sets but when comes to network capability, the gadget doesn’t seems to be at the leading edge with only EDGE or 2.5G support even when most of competitors already have 3G enabled handsets in the market.毫无疑问,有一些伟大的功能,如多卷和出色的软件集但是当谈到网络功能,该工具不会似乎是在领先,只有EDGE或支持的2.5G甚至当大多数的竞争对手已经启用的3G手机在市场上。 An UBS Analyst, Nicolas Gaudois speculated that the famous Germany chipmaker, Infineon will continue supplying Apple with its new HSDPA (High-Speed Downlink Packet Access) RF chip, replacing its current EDGE baseband solution for next generation Apple’s iPhone.一位UBS分析师尼古拉Gaudois推测,著名的德国芯片制造商英飞凌将继续与苹果公司提供新的HSDPA (高速下行分组接入)射频芯片,以取代目前的EDGE基带解决方案的下一代苹果的iPhone 。

The new chip, with HSDPA capability will consist of baseband controller and RF module integrated into one.新的芯片,与HSDPA功能将包括基带控制器和射频模块集成到一个。 Since the main reason for current iPhone to be limited to 2.5G is due to its high power consumption, the new chip is featured with some power management solution that able to provide better thermal efficiency needed for next generation or more powerful iPhone.自主要原因目前iPhone只限于到2.5G是由于其高能耗,新的芯片功能与一些电源管理解决方案,能够提供更好的热效率需要为下一代或更强大的iPhone 。 Analyst also stated that Infineon may not able to keep its production lines for both EDGE and 3G chips simultaneously, and should ramp down or eventually phased out, giving full swing to the mass production of its next generation 3G chip.分析家还指出,英飞凌可能无法保持其生产线都EDGE和3G芯片的同时,应坡道或最终逐步淘汰,使全力投入批量生产,其下一代的3G芯片。 The 3G enabled iPhone is believed to be available commercially by mid of this year.此外, 3G启用iPhone是被认为商用中旬今年。
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