3G Apple iPhone Potentially Powered by Infineon Chip Available This Year 3G Apple iPhone potenciāli Powered by Infineon Chip Pieejams Šogad
Apple's iPhone has been selling like hot cake since its official launch last year. Apple iPhone ir pārdošanā, piemēram, karstā kūka kopš tā oficiālās atklāšanas pagājušajā gadā. No doubt it has some great features such as multi scroll and excellent software sets but when comes to network capability, the gadget doesn't seems to be at the leading edge with only EDGE or 2.5G support even when most of competitors already have 3G enabled handsets in the market. Nav šaubu, ka ir dažas lieliskas iespējas, piemēram, vairākgadu ritinātu un lielisks programmatūras komplekti bet, kad runa par tīkla jaudu, sīkrīku nav, šķiet, ir pie malas tikai ar EDGE vai 2.5 atbalstu pat tad, kad vairums konkurentu jau ir 3G ļāva telefonu tirgū. An UBS Analyst, Nicolas Gaudois speculated that the famous Germany chipmaker, Infineon will continue supplying Apple with its new HSDPA (High-Speed Downlink Packet Access) RF chip, replacing its current EDGE baseband solution for next generation Apple's iPhone. UBS analītiķis, Nicolas Gaudois spekulējuši, ka slavenā Vācija chipmaker, Infineon turpinās piegādāt Apple ar savu jauno HSDPA (High-Speed downlink Packet Access) RF mikroshēma, aizstājot līdzšinējo EDGE baseband risinājums nākamās paaudzes Apple iPhone.
The new chip, with HSDPA capability will consist of baseband controller and RF module integrated into one. Jaunā mikroshēma ar HSDPA iespējām veidos baseband kontrolieris un RF modulis integrēts vienā. Since the main reason for current iPhone to be limited to 2.5G is due to its high power consumption, the new chip is featured with some power management solution that able to provide better thermal efficiency needed for next generation or more powerful iPhone. Tā kā galvenais iemesls, kāpēc pašreizējā iPhone tikai 2.5 ir saistīts ar tās augsto elektroenerģijas patēriņu, jauna mikroshēma, demonstrējot ar dažiem jaudas pārvaldības risinājums, kas spēj nodrošināt labāku siltuma efektivitāti, nepieciešama nākamās paaudzes vai jaudīgāks iPhone. Analyst also stated that Infineon may not able to keep its production lines for both EDGE and 3G chips simultaneously, and should ramp down or eventually phased out, giving full swing to the mass production of its next generation 3G chip. Analītiķis arī apgalvoja, ka Infineon var nebūt spējīgi saglabāt savu ražošanas līniju gan EDGE un 3G mikroshēmas vienlaikus, un būtu rampas uz leju vai uz laiku pakāpeniski, dodot pilnā sparā uz masveida ražošanu nākamās paaudzes 3G mikroshēmu. The 3G enabled iPhone is believed to be available commercially by mid of this year. 3G ļāva iPhone, domājams, ir komerciāli pieejamas vidū šajā gadā.
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