AMD Announced New Processors and Chipsets for Embedded Market AMD宣布新的處理器和芯片組的嵌入式市場
During the recent AMD Embedded Forum held in Taiwan, AMD unveiled a series of new processors and chipsets targeted for embedded market.在最近的AMD的嵌入式論壇在台灣舉行， AMD公司推出了一系列新的處理器和芯片組針對嵌入式市場。 These series of new products are either high performance or energy efficient that has able to fulfill current market demand for various segments.這些一系列新產品，要么高性能或能源效率已經能夠滿足當前市場需求的各個階層。 AMD Turion 64-bit Dual-Core processors are high end models whereas its Sempron 3700+ will be able to fit into low TDP (Thermal Design Power) envelope which is crucial for certain applications such as digital signage and interactive clients. AMD炫龍64位雙核心處理器的高端型號，而它的Sempron 3700 +將能夠適應低功耗（熱設計功率）信封這是至關重要的某些應用，如數字簽名和互動的客戶。
Besides the processor series, AMD also announced new chipsets to be paired with for its embedded roadmap.除了處理器系列， AMD公司還宣布新的芯片組來搭配其內置的路線圖。 Known as AMD M690E, it supports HD (High Definition) media decode and video playback with common interfaces such as memory and peripherals’ interfaces for external devices connectivity.被稱為AMD公司M690E ，它支持的HD （高清晰度）的媒體解碼器和視頻播放的共同接口，如內存和外設，接口外部設備的連接。 When coupled with the latest AMD processors, it offers a complete platform architecture solution for OEMs that can further developed an end products based on specific usage models.加上最新的AMD處理器，它提供了一個完整的平台架構解決方案的原始設備製造商，可以進一步發展的一個高端產品的基礎上的具體應用模式。
In order to assist customer in design, AMD plans to release new reference design kit based on COM Express form factor so that the development cycle and TTM (Time To Market) can be shorten without compromising the end product quality.為了協助客戶在設計， AMD計劃發布新的參考設計工具包的基礎上的COM Express的外形，使開發週期和泰國（時間市場）可以在不損害縮短最終產品的質量。 We should expect more products to be released by its main rivals such as Intel and VIA Technologies in this competative market.我們應該期待更多的產品將公佈其主要競爭對手，如英特爾和威盛在這competative市場。
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