AMD Announced New Processors and Chipsets for Embedded Market AMD宣布新的处理器和芯片组为嵌入式市场

During the recent AMD Embedded Forum held in Taiwan, AMD unveiled a series of new processors and chipsets targeted for embedded market.在最近的AMD嵌入式论坛在台湾举行， AMD公司推出了一系列新的处理器和芯片组针对嵌入式市场。 These series of new products are either high performance or energy efficient that has able to fulfill current market demand for various segments.这些一系列的新产品都是高性能或能源效率已经能够满足当前市场需求的各个环节。 AMD Turion 64-bit Dual-Core processors are high end models whereas its Sempron 3700+ will be able to fit into low TDP (Thermal Design Power) envelope which is crucial for certain applications such as digital signage and interactive clients.采用AMD Turion 64位双核心处理器是高端型号，而它的Sempron 3700 +将能够融入低的TDP （热设计功耗）的信封是至关重要的某些应用，如数字签名和互动的客户。

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Besides the processor series, AMD also announced new chipsets to be paired with for its embedded roadmap.除了处理器系列， AMD公司还宣布了新的芯片组搭配其嵌入式的路线图。 Known as AMD M690E, it supports HD (High Definition) media decode and video playback with common interfaces such as memory and peripherals’ interfaces for external devices connectivity.被称为AMD公司m690e ，它支持的HD （高清晰度）媒体解码和视频播放，有着共同的接口，如内存和外设， '接口外部设备连接。 When coupled with the latest AMD processors, it offers a complete platform architecture solution for OEMs that can further developed an end products based on specific usage models.加上最新的AMD处理器，它提供了一个完整的平台架构的解决方案，为OEM厂商，可以进一步发展的一个高端产品的基础上的具体使用模式的优势。

In order to assist customer in design, AMD plans to release new reference design kit based on COM Express form factor so that the development cycle and TTM (Time To Market) can be shorten without compromising the end product quality. ，以协助客户在设计， AMD计划发布新的参考设计工具包基于COM的表达形式因素，使开发周期和12个月（市场的时间）可以缩短而不损害最终产品的质量。 We should expect more products to be released by its main rivals such as Intel and VIA Technologies in this competative market.我们应该期望更多的产品予以公布，其主要竞争对手如英特尔和威盛科技在这competative市场。

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