AMD Announced New Processors and Chipsets for Embedded Market AMD napovedani novi procesorji in nize čipov za Embedded Market
During the recent AMD Embedded Forum held in Taiwan, AMD unveiled a series of new processors and chipsets targeted for embedded market. Med nedavnim forumom AMD vgrajenih v Tajvanu, AMD razkrila niz novih procesorjev in nize čipov, ciljani za vgrajene trgu. These series of new products are either high performance or energy efficient that has able to fulfill current market demand for various segments. Ta vrsta novih proizvodov so visoke dosežke ali energetsko učinkovita, da je sposoben izpolniti trenutne tržne potrebe v različnih segmentih. AMD Turion 64-bit Dual-Core processors are high end models whereas its Sempron 3700+ will be able to fit into low TDP (Thermal Design Power) envelope which is crucial for certain applications such as digital signage and interactive clients. AMD Turion 64-bit Dual-Core procesorjev so visoke end modelov ker je Sempron 3700 + se bo lahko spadajo v nizko TDP (Thermal Design Power) sredstva, ki je ključnega pomena za določene aplikacije, kot so digitalne signalizacije in interaktivne strank.
Besides the processor series, AMD also announced new chipsets to be paired with for its embedded roadmap. Poleg procesorja serije, AMD tudi napovedala nove nize čipov, ki jih lahko vezati na svoje vgrajeni načrt. Known as AMD M690E, it supports HD (High Definition) media decode and video playback with common interfaces such as memory and peripherals' interfaces for external devices connectivity. Znan kot AMD M690E, podpira HD (High Definition) media dekodiranje in predvajanje video skupnih vmesnikih, kot so pomnilnik in periferne enote "vmesnike za zunanje naprave povezljivost. When coupled with the latest AMD processors, it offers a complete platform architecture solution for OEMs that can further developed an end products based on specific usage models. V kombinaciji z najnovejšimi AMD procesorje, ki jih ponuja popolno platformo arhitektura rešitve za OEMs, ki lahko nadalje razvijati konec proizvodov, ki temeljijo na uporabi posebnih modelov.
In order to assist customer in design, AMD plans to release new reference design kit based on COM Express form factor so that the development cycle and TTM (Time To Market) can be shorten without compromising the end product quality. Za pomoč stranki v načrtovanje, AMD načrti za sprostitev novih referenčnih design kit ki temelji na COM Express form faktor, tako da se razvojnem ciklu in čas do realizacije (time to market) se lahko skrajšajo, brez ogrožanja kakovosti končnega proizvoda. We should expect more products to be released by its main rivals such as Intel and VIA Technologies in this competative market. Morali bi pričakovali več proizvodov, ki se sprosti s svojimi glavnimi tekmeci, kot so Intel in VIA Technologies v tem konkurenčnem trgu.
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