AMD Announced New Processors and Chipsets for Embedded Market AMD Najavljen Novi procesori i Chipsets za tržište Embedded
During the recent AMD Embedded Forum held in Taiwan, AMD unveiled a series of new processors and chipsets targeted for embedded market. Tijekom nedavnog AMD Embedded Forum je održan u Tajvan, AMD unveiled niz novih procesora i chipsets ciljana za ugrađen tržište. These series of new products are either high performance or energy efficient that has able to fulfill current market demand for various segments. Ovi niz novih proizvoda ili visoke performanse ili energetski efikasna koja je u stanju da ispuni tekuće tržišne potražnje za raznim segmentima. AMD Turion 64-bit Dual-Core processors are high end models whereas its Sempron 3700+ will be able to fit into low TDP (Thermal Design Power) envelope which is crucial for certain applications such as digital signage and interactive clients. AMD Turion 64-bitni Dual-Core procesore su visoki kraj svojih modela dok Sempron 3700 + moći će stati u nisko TDP (Thermal Design Power) omotnica koja je od ključne važnosti za određene programe kao što su digitalni Signage i Interactive.
Besides the processor series, AMD also announced new chipsets to be paired with for its embedded roadmap. Osim procesora serije, AMD je najavio novi chipsets biti upareni s ugrađenim Putokaz za svoje. Known as AMD M690E, it supports HD (High Definition) media decode and video playback with common interfaces such as memory and peripherals' interfaces for external devices connectivity. Poznat kao AMD M690E, podupire HD (High Definition) media dekodirati i video reprodukcije sa zajedničkog sučelja kao što su memorija i periferne 'sučelja za vanjske uređaje povezivanja. When coupled with the latest AMD processors, it offers a complete platform architecture solution for OEMs that can further developed an end products based on specific usage models. U kombinaciji s najnovijim AMD procesorima, nudi kompletnu platformu arhitektura rješenja za OEMs koji mogu dodatno razvijen kraj proizvodi na temelju određenih korištenje modela.
In order to assist customer in design, AMD plans to release new reference design kit based on COM Express form factor so that the development cycle and TTM (Time To Market) can be shorten without compromising the end product quality. U cilju pomoći kupcu u dizajnu, AMD planira otpustiti novi referentni dizajn kit zasnovan na obliku COM Express faktor, tako da je razvoj ciklus i TTM (Time To Market) može se skratiti na kraju bez ugrožavanja kvalitete proizvoda. We should expect more products to be released by its main rivals such as Intel and VIA Technologies in this competative market. Valja očekivati više proizvoda koji će se objaviti svoj glavni konkurenata kao što su Intel i VIA Technologies u ovome competative tržištu.
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