Intel's Moorestown Initial Features Leaked Before Official Launch in 2009 Intel Moorestown Initial Features noplūda pirms 2009 Launch Oficiālajā
It has been a while since Intel talked about its Moorestown platform which appeared in the roadmap after the Silverthorne as ultra low power silicon dedicated for UMPC (Ultra Mobile PC) and MID (Mobile Internet Device) market, but it seems that the available information is very limited to public. Tas ir gan kopš Intel runāja par savu Moorestown platforma, kas parādījās plānu pēc Silverthorne par ārkārtīgi zemu jaudu silikona atvēlēs UMPC (Ultra Mobile PC) un MID (Mobile Internet Device) tirgū, bet šķiet, ka pieejamā informācija ir ļoti ierobežota, lai sabiedrībai. Now more information has been disclosed and some of the manufacturers could have started to align their roadmap accordingly. Tagad vairāk informācija ir atklāta un daži ražotāji varēja sāka sakārtot savu plānu atbilstoši.
Moorestown is believed to consist of two silicons; Linroft and Langwell. Moorestown, domājams, sastāv no diviem silikoni, Linroft un Langwell. You may wonder what all these special names are about. Jums var brīnīties, ko visi šie īpašie nosaukumi ir par. There are just some codenames being used by the giant chip maker for the processor as well as chipset differentiation. Ir tikai daži codenames izmanto ar milzu chip maker par procesoru, kā arī chipset diferenciāciju. Lincroft is the CPU or the successor of Silverthorne, a 45 nm process technology fabricated processor whereas Langwell is the IO chip that provides interconnects to external peripherals. Lincroft ir CPU vai pēcteci Silverthorne, 45 nm procesa tehnoloģiju Gatavo procesors tā Langwell ir IO mikroshēma, kas nodrošina savieno ar ārējām perifērijas. Langwell is expected to combine all the controller hubs inclusive of memory controller as well as graphics accelerator into single chips. Langwell ir paredzēts apvienot visus kontrolieris mezgli, ieskaitot atmiņas kontrolieris, kā arī grafikas paātrinātājs vērā vienu mikroshēmu. Some advanced features such as DDR3 memory controller, PCI Express, USB and Serial ATA are also in the list. Dažas progresīvas funkcijas, piemēram, DDR3 atmiņas kontrolieris, PCI Express, USB un Serial ATA arī ir sarakstā.
Interestingly, the architecture will change quite significantly with the DMI bus replacing current FSB (Front side bus) for processor and chipset just like what will be implemented in Nahelem. Interesanti, arhitektūra mainās diezgan ievērojami DMI autobusu aizstāt pašreizējo FSB (Front Side Bus) attiecībā uz procesoru un mikroshēmojumu tāpat kā to, kas tiks īstenoti Nahelem. More importantly, the performance per watt will scale up significantly since the total power is believe to be only one fifth of Silverthorne processor. Vēl svarīgāk, par vatu sniegumu skalā veido ievērojami, jo kopējā jauda ir uzskatu par tikai vienu piekto daļu Silverthorne procesoru. Latest roadmap information showed that the Moorestown platform will be available to market by mid of 2009. Jaunākās ceļvedī informācija rāda, ka Moorestown platforma būs pieejama tirgus vidū 2009.
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October 22nd, 2008 00:06 22 oktobris 2008 00:06
[...] one year of Initial Featured leak on Moorestown, now the actual prototype has just been showcased during the recent IDF (Intel Developer Forum) [...] [...] Vienu gadu pēc sākotnējās Featured noplūdes uz Moorestown, tagad faktiski prototips jau tika izrādīti laikā pēdējo IDF (Intel Developer Forum) [...]