Intel Nehalem Specification Comparison with AMD Core Architecture英特爾尼黑勒姆規格比較與AMD核心架構

Intel is planning to release the next generation processor architecture for the high end PC market by end of 2008.英特爾正計劃推出下一代處理器架構的高端PC市場2008年年底。 The new core processor architecture is quite different from any of its predecessor even in current Penryn product.新的核心處理器架構完全不同任何其前任即使在目前的Penryn產品。 Interestingly, some of the features set could be in similarity to AMD technologies.有趣的是,一些功能設置可相似對AMD的技術。 Known as code name of Nehalem, the actual performance is expected to be much higher as compared to any of the series that exist in today market.被稱為代號尼黑勒姆,實際業績預期要高得多相比,任何存在的一系列在當今市場。

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One of great features is the memory controller integration into the silicon die that is believed to be able to boost the whole system performance significantly.一個偉大的特點是內存控制器集成到矽片這被認為是能夠提高整個系統的性能顯著。 An onboard memory controller will improve the memory access latency as compared to traditional memory access through dedicated bus interface.內存控制器將提高內存訪問的延遲相比,傳統的記憶體存取通過專門的總線接口。 If you are aware, current AMD core architecture such as K8 already has memory controller being integrated on the silicon level.如果大家都知道,目前AMD的核心架構,如K8平台已經內存控制器被集成在矽片的水平。

Besides this, Nehalem is supported by a high speed internal bus known as Quick Path Interconnect.此外,尼黑勒姆支持高速內部總線稱為快速路徑互連。 It will replace current FSB (Front Side Bus) in most of the current design.它將取代目前的前端總線(前端總線)在大多數當前的設計。 Again, the concept is quite similar to existing HyperTransport technology available in current AMD silicon.再次,這個概念很類似於現有的HyperTransport技術可在目前AMD的芯片。 Of course they are differences in terms of technology and protocol involved to make them more powerful since Intel is always in leading position with clear roadmap and advanced process technology.當然,他們的分歧方面的技術和議定書的參與,使他們更強大,因為英特爾始終處於領先地位有明確的路線圖和先進的工藝技術。 On top of these, some of the new features which will be implemented in this silicon are multiple cores with new HT (Hyper-threading) technology, 8MB sharable L3 cache size as well as DDR3 memory support.除了這些,一些新的特點,將實施這一芯片是多核心的新羥色胺(超線程)技術, 8 MB的共享L3緩存大小,以及DDR3內存的支持。

Only one drawback, the existing socket design is no longer suitable for use with the new silicon.只有一個缺點,現有的插座設計已不再適用於新的芯片。 In other words, it is not backward compatible with current platform in the market and hence OEMs will need to invest more during initial design stage later.換句話說,它不是向後兼容現有平台的市場,因此原始設備製造商將需要更多的投資在初步設計階段以後。

IMPORTANT : This is a machine translated page which is provided "as is" without warranty. 重要說明:這是一台機器翻譯網頁這是“原樣”提供,無保修。 Machine translation may be difficult to understand.機器翻譯可能很難理解。 Please refer to請參閱 original English article英文原文的文章 whenever possible.只要有可能。

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One Response to “Intel Nehalem Specification Comparison with AMD Core Architecture”一個響應“英特爾尼黑勒姆規格比較與AMD核心架構”

  1. cssadc
    November 1st, 2007 01:42 2007年11月一日01:42
    1

    what a great “NEWS”!什麼是偉大的“新聞” !

    hell when you have no info then write nothing.地獄當你有沒有信息然後寫什麼。
    whats up with you guys?什麼了你們? this info is out for ages..此信息是為年齡.. nothing new…..新鮮事... .. and where is the comparisation… you suck….而是comparisation ...你吸... 。

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