USB 3.0 Physical Connector Design Unveiled To Public °ø°ø usb 3.0 ¹°¸®Àû Ä¿³ØÅ͸¦ µðÀÚÀÎ ¹ßÇ¥

Recently we just talked about the ÃÖ±Ù¿¡ ´ëÇØ ¾ê±â¸¦ ¿ì¸®°¡ USB 3.0 specification usb 3.0 »ç¾ç that is going to be released in early next year. ÀÌ µÉ ³»³â ÃÊ¿¡ ¹ßÇ¥ÇÕ´Ï´Ù. And now there seems to be a preliminary physical connector shape being disclosed during the recent IDF (Intel Developer Forum). ±×¸®°í Áö±Ý ¹®Á¦°¡ ¹ß»ýÇÑ °Í Áß¿¡ °ø°³ ¿¹¼± ¹°¸®Àû Ä¿³ØÅÍ ¸ð¾çÀÌ ÃÖ±ÙÀÇ idf (ÀÎÅÚ °³¹ßÀÚ Æ÷·³). During the event, there were few plugs and receptacles connector design being showcased by a team of USB 3.0 Promoters. ÀÌ Çà»çÇÏ´Â µ¿¾È ÀÖ¾ú´ø ¸î Ç÷¯±×¿Í Äܼ¾Æ® ÆÀ¿¡ ÀÇÇØ Àü½ÃµÇ´Â Ä¿³ØÅ͸¦ ¼³°è usb 3.0 ÃßÁøÇÕ´Ï´Ù.

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The USB 3.0 is supposed to be backward compatible with existing USB 2.0 specification devices in the market. the usb 3.0ÀÌ ÀÖ¾î¾ß ±âÁ¸ÀÇ usb 2.0 »ç¾ç°ú ȣȯ ÀåÄ¡¸¦ ÀÌÀüÀÇ ½ÃÀå. So, in terms of internal pin layout, it should be pin to pin compatible to its predecessor products. ±×·¡¼­, ¿©·¯ºÐÀÌ ¾à°üÀÇ ³»ºÎ ÇÉ ·¹À̾ƿô, ±×°ÍÀº ÇÉÀ» ÇÉ È£È¯ÀÌ Á¦Ç°ÀÇ Àü½ÅÀÎÇÕ´Ï´Ù. However, since the actual throughput will be 10 times faster than current USB 2.0, there will be some high speed design specification being complied before it is ready to be released for commercial market. ±×·¯³ª, ÀÌÈÄÀÇ ½ÇÁ¦ 󸮷®Àº ÇöÀ纸´Ù 10 ¹è ºü¸¥ usb 2.0, °í¼Ó ¼³°è »ç¾çÀÌÀÖÀ» ¾ÊÀº ÀϺΰ¡ µÉ Áغñ°¡µÇ±â Àü±îÁö´Â »ó¾÷ÀûÀÎ ½ÃÀå Ãâ½ÃÇÕ´Ï´Ù. In view of this high speed requirement, there is a plan to replace conventional cable type with optical fiber for gigabyte (in this case of 4.8GB) data transmission. ÀÌ °í¼ÓÀÇÀÌ ¹®¼­°¡ Àû¿ëµÇ´Â ¿ä±¸ »çÇ×, ±âÁ¸ÀÇ ÄÉÀ̺íÀ» ±³Ã¼ÇÏ´Â ¹æ¾ÈÀÌ ±¤¼¶À¯¿¡ ´ëÇÑ Çü½ÄÀ» ±â°¡ ¹ÙÀÌÆ® (ÀÌ °æ¿ì¿¡´Â 4.8±â°¡¹ÙÀÌÆ®) µ¥ÀÌÅ͸¦ Àü¼ÛÇÕ´Ï´Ù. With the replacement of optical fiber, the length of cable is able to be extended due to the nature of how optical signal travels in the fiber line. ±¤Çаú ´ëü ¼¶À¯, ÄÉÀ̺íÀÇ ±æÀ̸¦ ¿¬ÀåÀ¸·Î ÀÎÇØ ¼öÀÖ½À´Ï´Ù ±¤ÇÐ ½ÅÈ£¸¦ ¿©ÇàÇÏ´Â ¹æ¹ý¿¡ÀÇ º»ÁúÀ» ¼¶À¯ ¼±ÇÕ´Ï´Ù.

Nothing is firmed out at this moment. Áö±ÝÀÌ ¼ø°£ ¾Æ¹«°Íµµ firmed ¾Æ¿ôÇÕ´Ï´Ù. But the initial reveal of the actual shape has indicated a good sign that the product can be designed and made available soon after the specification release. ±×·¯³ª Ãʱ⠹àÈ÷ÁöÀÇ ½ÇÁ¦ ¸ð¾çÀÌ Á¦Ç°¿¡ ´ëÇØ ÁÁÀº ¡Á¶´Â ÁöÀû ¼³°è ¹× ÀÌ¿ëÇÒ ¼öÀÖ½À´Ï´Ù Á÷ÈÄÀÇ »ç¾ç Ãâ½ÃÇÕ´Ï´Ù.

IMPORTANT : This is a machine translated page which is provided "as is" without warranty. Áß¿ä »çÇ× : À̰ÍÀº ±â°è ¹ø¿ª ÆäÀÌÁö´Â "ÀÖ´Â ±×´ë·Î"Á¦°øÇÏÁö ¾Ê°í º¸ÁõÇÕ´Ï´Ù. Machine translation may be difficult to understand. ±â°è ¹ø¿ªÀ» ÀÌÇØÇϱ⠾î·Á¿ï ¼öÀÖ½À´Ï´Ù. Please refer to ¸¦ ÂüÁ¶ÇϽñ⠹ٶø´Ï´Ù original English article ±âÁ¸ ¿µ¾î ÀÚ·á whenever possible. ¾ðÁ¦ ¼öÀÖ½À´Ï´Ù.

Share and contribute or get technical support and help at ¸¦ °øÀ¯ÇÏ°í ±â¼ú Áö¿ø ¹× µµ¿òÀ» °øÇåÇÏÁö ¾Ê´Â´Ù¸é My Digital Life Forums ³» µðÁöÅÐ ¶óÀÌÇÁ °ø°³ Åä·Ð . ÇÕ´Ï´Ù.



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