Intel's Menlow Platform Possibly Targets For Low Cost Laptop Market Intel's Menlow Platform Iespējams mērķus zemu izmaksu klēpjdatoru tirgus
Analysts is speculating that the low-cost laptops targeting for developing countries are going to adopt the reference design based on Menlow platform. Analysts ir spekulācijas, ka zemu izmaksu klēpjdatoriem mērķauditorijas jaunattīstības valstis gatavojas pieņem atsauces dizains, pamatojoties uz Menlow platformu. Menlow platform has recently appeared in the road map for the product category with extremely low power envelope of less than 10 watt range. Menlow platforma nesen parādījās ceļa karte attiecībā uz izstrādājumu kategoriju, kam ir ļoti mazjaudas aploksnē, kas ir mazāks nekā 10 vatu diapazonā. Some of the low-cost laptop initiatives such as Classmate PC initiated by Intel and OLPC (One laptop per child) by MIT will design in its next generation products based on this low power architecture. Dažas no zemo cenu klēpjdators iniciatīvām, piemēram, klases PC uzsāk Intel un OLPC (Viena klēpjdators katram bērnam), ko MIT izstrādās tās nākamās paaudzes produktus, kuri pamatojas uz šo mazjaudas arhitektūru.
Menlow platform is famous for its low power dissipation and small form factor. Menlow platforma ir slavena ar tās zemo jaudas izkliedes un mazo formu faktors. Its fan-less design and high performance per watt and cost have made it the best candidate to be used in embedded world for the development of low cost laptops. Tās ventilatoru mazāku dizainu un augstas veiktspējas uz vienu vatu un izmaksas ir tas labākais kandidāts, kas jāizmanto iegultiem pasaule, lai attīstītu zemu izmaksu klēpjdatorus. These laptops were originally targeted with quote of less than $150 but were revised to around $200 due to increase in total BOM (Bill of Material) cost especially on NAND flash memory. Šīs klēpjdatoriem sākotnēji mērķtiecīgas ar cenas piedāvājumu, kas mazāks par $ 150, bet tika pārskatītas aptuveni $ 200, jo palielinoties kopējam BOM (Bill materiālu) izmaksas, jo īpaši, NAND flash atmiņu.
Intel does not respond to this officially and just mentioned that the actual CPU and chipset being used are still yet to be finalized. Intel neatbild šim oficiāli un tikai minēts, ka faktiskā CPU un Chipset tiek izmantotas vēl joprojām vēl nav pabeigta. Meanwhile, OLPC also stated that they are still sourcing among few chip makers such as AMD, Marvell and Intel for its next generation products. Tikmēr OLPC arī paziņoja, ka tie joprojām ir izcelsmes vidū dažas mikroshēmas veidotājiem, piemēram, AMD, Marvell un Intel par nākamās paaudzes produktus. It is believed that the products with the new design will be launched by end of next year. Pastāv uzskats, ka produkti ar jauno projektu, ko uzsāka beigām nākamgad.
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