Samsung Unveils 4GB Multi-Chip Package (MCP) for 3G Mobile Market三星公司推出4GB的多芯片封装（ MCP ）的3G移动通信市场
Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4GB multi-chip package (MCP) targeted at 3G mobile phones market.三星电子公司，是全球领先的半导体和电信制定了一个4GB的多芯片封装（ MCP ）针对3G手机市场。 This innovation has eliminated the need to implement external memory card slot and software development for NAND memory that significantly simplifies the design and time-to-market for the mobile phone manufacturers.这一创新已经消除，需要执行的外部存储卡插槽和软件开发的NAND记忆体，大大简化了设计和上市时间的移动电话制造商。
The new MCP integrates a 4GB embedded memory, which consists of 1Gb mobile DRAM and 2Gb NAND flash for mobile operation.新的MCP采用了4GB的嵌入式记忆体，其中包括的1Gb移动DRAM和2Gb的NAND闪存芯片的移动操作。 On top of that, it combines two 16-Gb NAND flashes that can be used as permanent storage for multimedia files such as movie clips, mp3 songs, GPS (Global Positioning Satellite) map and etc.最重要的是，它结合了两个16千兆NAND型闪光灯，可做为永久储存的多媒体文件，如电影片段， MP3歌曲， GPS （全球定位卫星）等地图
While providing high-density memory with small footprint, this solution also maintains high speed transmission with low noise interference which becomes an ideal choice for mobile market segment.同时提供高密度存储器的小尺寸，这一解决方案还保持高速传输与低噪声干扰，因而成为理想的选择移动市场。
Market researcher forecasts that the 3G mobile phone market is expected to reach 392 million units in 2007.市场研究公司预测， 3G手机市场预计将达到3.92亿单位在2007年。 This is definitely a good news for Samsung as where its market segment is.这无疑是一个好消息，三星在其细分市场的。
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