Samsung Unveils 4GB Multi-Chip Pachet (MCP) pentru 3G Mobile Pia��

Samsung Electronic, un global leader �n�untru semiconductor �i telecommunication has dezvoltat un 4GB multi-chip pachet (MCP) targeted la 3G mobile telefon pia��. This innovation has eliminated art.hot. nevoie la spre implement external memorie carte slot �i produse de plastic dezvoltare pentru NAND memorie that significantly simplifies art.hot. design �i timp- la spre- pia�� pentru art.hot. mobile telefon manufacturers.

Art.hot. nou MCP integrates un 4GB embedded memorie, care a considera de 1Gb mobile DRAM �i 2Gb NAND fulger pentru mobile opera�ie. On top de that, it combines doi 16-Gb NAND fulger that a putea a fi folosit as permanent magazin pentru multimedia dosar such as film clips, mp3 songs, GPS ( global Positioning Satelit) plan �i etc.

While providing high-density memorie cu mic footprint, this solution de asemenea maintains high cuv�ntare transmisie cu low zgomotos interference care becomes un ideal choice pentru mobile pia�� segment.

Pia�� researcher forecasts that art.hot. 3G mobile telefon pia�� is a�teptat la spre reach 392 moar� unit �n�untru 2007. Acesta este definitely un bun veste pentru Samsung as unde s�u pia�� segment is.

import: Art.hot. pagin� is machine a traduce �i provided "as is" f�r� warranty. Machine traducere Mai a fi difficult la spre understand. A face pe plac la refer la spreorigine Englez anghinar� oric�nd posibil.

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